165 lines
7.5 KiB
JSON
165 lines
7.5 KiB
JSON
{
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"containers": {
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"cna": {
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"affected": [
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{
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"product": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables",
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"vendor": "Qualcomm, Inc.",
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"versions": [
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{
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"status": "affected",
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"version": "AR8035, QAM8295P, QCA6174A, QCA6391, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM6490, QCS410, QCS610, QCS6490, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SD480, SD778G, SD780G, SD888, SD888 5G, SDX12, SDX65, SM6375, SM7315, SM7325P, SW5100, SW5100P, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN3991, WCN3998, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835"
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}
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]
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}
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],
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"descriptions": [
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{
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"lang": "en",
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"value": "Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables"
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}
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],
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"metrics": [
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{
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"cvssV3_1": {
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"attackComplexity": "LOW",
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"attackVector": "LOCAL",
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"availabilityImpact": "HIGH",
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"baseScore": 8.4,
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"baseSeverity": "HIGH",
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"confidentialityImpact": "HIGH",
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"integrityImpact": "HIGH",
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"privilegesRequired": "NONE",
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"scope": "UNCHANGED",
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"userInteraction": "NONE",
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"vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
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"version": "3.1"
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}
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}
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],
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"problemTypes": [
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{
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"descriptions": [
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{
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"description": "Use After Free in Graphics",
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"lang": "en",
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"type": "text"
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}
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]
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}
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],
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"providerMetadata": {
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"dateUpdated": "2022-06-14T10:11:29.000Z",
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"orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
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"shortName": "qualcomm"
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},
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"references": [
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{
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"tags": [
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"x_refsource_CONFIRM"
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],
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"url": "https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin"
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}
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],
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"x_legacyV4Record": {
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"CVE_data_meta": {
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"ASSIGNER": "product-security@qualcomm.com",
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"ID": "CVE-2021-35130",
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"STATE": "PUBLIC"
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},
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"affects": {
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"vendor": {
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"vendor_data": [
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{
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"product": {
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"product_data": [
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{
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"product_name": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables",
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"version": {
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"version_data": [
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{
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"version_value": "AR8035, QAM8295P, QCA6174A, QCA6391, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM6490, QCS410, QCS610, QCS6490, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SD480, SD778G, SD780G, SD888, SD888 5G, SDX12, SDX65, SM6375, SM7315, SM7325P, SW5100, SW5100P, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN3991, WCN3998, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835"
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}
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]
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}
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}
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]
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},
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"vendor_name": "Qualcomm, Inc."
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}
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]
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}
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},
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"data_format": "MITRE",
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"data_type": "CVE",
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"data_version": "4.0",
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"description": {
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"description_data": [
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{
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"lang": "eng",
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"value": "Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables"
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}
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]
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},
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"impact": {
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"cvss": {
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"baseScore": 8.4,
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"vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
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"version": "3.1"
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}
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},
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"problemtype": {
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"problemtype_data": [
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{
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"description": [
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{
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"lang": "eng",
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"value": "Use After Free in Graphics"
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}
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]
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}
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]
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},
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"references": {
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"reference_data": [
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{
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"name": "https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin",
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"refsource": "CONFIRM",
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"url": "https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin"
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}
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]
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}
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}
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},
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"adp": [
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{
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"providerMetadata": {
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"orgId": "af854a3a-2127-422b-91ae-364da2661108",
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"shortName": "CVE",
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"dateUpdated": "2024-08-04T00:33:51.033Z"
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},
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"title": "CVE Program Container",
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"references": [
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{
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"tags": [
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"x_refsource_CONFIRM",
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"x_transferred"
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],
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"url": "https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin"
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}
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]
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}
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]
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},
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"cveMetadata": {
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"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
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"assignerShortName": "qualcomm",
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"cveId": "CVE-2021-35130",
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"datePublished": "2022-06-14T10:11:29.000Z",
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"dateReserved": "2021-06-21T00:00:00.000Z",
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"dateUpdated": "2024-08-04T00:33:51.033Z",
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"state": "PUBLISHED"
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},
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"dataType": "CVE_RECORD",
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"dataVersion": "5.1"
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} |